Thick film technology is traditionally an additive process, that is the various components are produced on the substrate by applying ‘pastes’ (or ‘inks’) and are added sequentially to produce the required conductor patterns and resistor values. Different formulations of paste are used to produce conductors, resistors and dielectrics (for crossovers or, occasionally, capacitors).
Each paste contains:
- A binder, a glassy frit
- The carrier, organic solvent systems and plasticizers
- The materials to be deposited, typically pure metals, alloys, and metal oxides
The metal particles are bound together and to the substrate by the glassy phase, and this is particularly important at the substrate-ink interface. Fired surfaces are usually not even or homogeneous on a micro scale, a fact which can lead to problems when wire bonding.
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