Thursday, July 21, 2011

Furnace for Thick Film Application


HSK series belt furnaces serve diverse industries such as microelectronics packaging, which include IC, SMT, HIC, MCM and MEMS applications, and advanced materials, including thick film, electronic component, photovoltaic cells, ceramics and metals processing applications. 

The HSK series fast fire furnace heats from ambient to 1050°C in approximately 40 minutes and is designed to sustain continuous on/off heating and cooling cycles resulting from alternating periods of production and non-use.  It features an ultra-clean low-mass refractory heating chamber equipped with FEC (Fully Enclosed Coil) heaters formed into ceramic insulation panels.  With the use of advanced insulation materials, lower thermal capacity enables the furnace to warm up and cool down very quickly and lose less heat to the environment. 

The furnace is monitored by type “K” thermocouples in the center of each heated zone.  Each temperature zone is control-led by its own SHIMADAN SR94 single loop intelligent temperature controller with full auto-tuning PID.  The single wave, zero trigger method enables precise and stable temperature control, avoiding damages to the peripheral equipment while prolonging the life of controlling devices at the same time. 

The furnace belt is balanced spiral Nichrome V mesh.  The belt speed is programmable in IPM with readout right on the monitor and deviation from set point alarm is also programmable.  Stepless speed regulation is controlled by FUJI frequency converter and is digitally displayed. 

The furnace is equipped with entrance/exit curtains and an exhauster to improve drying/firing temperature stability, as well as, to keep the firing chamber clean.  The 200mm (8”) diameter air powered Venturi exhauster supports full chamber width exhausting.  There are removable condensate collection traps and the exhaust flow can be adjusted by the flow meter.  

For more info or to get a quote please go to http://www.beltfurnaces.com

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