Thick film technology is an established method for efficiently manufacturing hybrid microelectronic circuitry. The thick film process can be defined as the sequential printing and firing of conductor, resistor, and dielectric paste formulations onto a substrate.
Thick films are typically in the range 5–50µm thick. This distinguishes a hybrid from thin film technology in which films are deposited by vacuum evaporation or sputtering processes and the thickness is usually less than 1µm. the range of resistivities is 10Ω/square to 10MΩ/square, there are considerable possibilities for building multi-layer structures.
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